BERGQUIST GAP FILLER TGF 3600-Suzhou Aptel Electronics Technology

BERGQUIST GAP FILLER TGF 3600

BERGQUIST GAP FILLER TGF 3600 is a two-component silicone thermal gap filler with a thermal conductivity of 3.6 W/m-K. Its two-component form facilitates dispensing, making it suitable for scenarios such as automotive electronics and PCB enclosures. It can be stored hermetically for 5 months at 5-25℃. After curing, it features a low modulus, which can meet the thermal management needs of fragile components.

Message

Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

Favored

Product Details

产品描述

Technical Type: Silicone
Component A Appearance (Uncured): Blue
Component B Appearance (Uncured): White
Mixed Appearance: Blue
Curing Method: Room temperature curing or thermal curing
Application Scenarios: Thermal management, TIM (Thermal Interface Material)
Weight Mixing Ratio (A:B): 1:1
Volume Mixing Ratio (A:B): 1:1
Operating Temperature Range: -60 to 200℃

Product Features

Two-component form for easy dispensing
Excellent thixotropy and convenient storage
Superior conformability, specifically designed for fragile, low-stress components; compatible with fast-curing formulations

Typical Applications

Automotive electronics (hybrid electric vehicles (HEVs)/battery electric vehicles (BEVs), batteries)
PCB enclosures
Discrete components inside enclosures
Fiber optic communication equipment

Storage Conditions

Optimal storage conditions: 5-month shelf life when stored in hermetically sealed, moisture-proof packaging at 5-25ºC.