Two-Component Thermal Gel HiC-Pad8000LV
The HiC-Pad8000LV Series Two-Component Thermal Gel is a high-thermal-conductivity, high-flow-rate, room-temperature-curing thermal gel with a thermal conductivity of 8.0 W/m·K. It also boasts prominent features including low volatility, low oil seepage and anti-sedimentation, making it particularly suitable for applications requiring both high-flow-rate automated dispensing and a certain degree of adhesiveness after curing.

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