HiSP3000 is a two-component, room-temperature-curing silicone thermally conductive potting adhesive featuring medium-to-high thermal conductivity and medium-to-low viscosity. The curing process can also be accelerated by heating. This material is primarily designed for high-power power supplies, photovoltaic inverters, and other related applications. It exhibits excellent fluidity after mixing, facilitating easy cavity filling and potting. The curing time is adjustable according to temperature, and the material cures to form a flexible silicone elastomer.

HiSP3000 not only enables efficient transfer of heat generated by chips during operation to the external environment via heat sinks or device housings, but also provides reliable protection for devices. It shields devices from the impacts of moisture, shock, vibration, and other external environmental factors, ensuring the long-term stable operation of the devices.