HiGrease400 Thermal Grease is a high-performance thermal grease based on silicone resin. Its excellent thixotropy prevents slumping during dispensing or screen printing processes, thus reducing operational difficulty. With a high thermal conductivity of 4.0 W/m·K and a minimum bond line thickness of 25 μm, it can fully fill the contact interface and minimize interfacial thermal resistance to the greatest extent.

HiGrease400 Thermal Grease features excellent reliability with low oil bleeding and no drying-out issues, making it widely applicable to high-power devices such as CPUs, GPUs, ASICs, northbridge chips and other heat-generating components.