HiPad5000PI(HT)-Suzhou Aptel Electronics Technology

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Plasma Cleaner Adhesive Thermal Interface Material Lubricant Cleaning Agent Release Agent Nanocoating Dispensing Equipment

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Adhesive Thermal Interface Material Cleaning Agent Release Agent Nanocoating

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HiPad5000PI(HT)

HiPad5000PI(HT) is an ultra-thin, high-temperature-resistant, high thermal conductivity, high insulation, puncture-resistant and scratch-resistant thermal conductive insulating gasket material with a thermal conductivity coefficient of 4.0 W/m·K. The material adopts a composite structure consisting of a high-performance thermal conductive insulating layer and a highly insulating polyimide film. Its typical thickness ranges from 0.3 mm to 1.0 mm, with a standard thickness increment of 0.05 mm.

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Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

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Product Details

Product Parameters

Product Features

Thermal conductivity: 4.0 W/m·K
Ultra-thin thickness, minimum thickness of 0.3 mm
High-temperature resistance
High insulation performance
Compliance with RoHS/REACH environmental standards

Typical Applications

New energy vehicles
Industrial frequency converters
IGBT (Insulated Gate Bipolar Transistor)

Available Packaging
Standard size: 450mm × 450mm; custom die-cutting available according to customer application dimensions

Storage Conditions
Shelf life is 24 months from the date of manufacture when stored at room temperature.