HiBond3002-Suzhou Aptel Electronics Technology

HiBond3002

HiBond 3002 is a thermosetting thermally conductive adhesive based on a two-component addition-curable silicone polymer matrix, featuring excellent thermal conductivity. After high-temperature curing, the product exhibits extremely stable bonding strength and can maintain long-term stability at 150℃. Since no metallic fillers are added to this adhesive, it delivers outstanding electrical insulation performance.

By means of powder particle size adjustment, HiBond 3002 achieves high thermal conductivity while imparting low thermal resistance characteristics. Meanwhile, its thin interfacial layer makes it more suitable for application in high-precision electronic products.

Message

Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

Favored

Product Details

Product Parameters

Product Features

High thermal conductivity
Low adhesive layer thickness
High bonding strength
Silicone-based system with high operating temperature
Compliance with RoHS/REACH environmental standards

Typical Applications

Automotive electronic devices
Bonding of heat sinks to metal and plastic components in electronic and electrical appliances
Adhesion to metals, organic materials and ceramics (e.g., PCB, HDI, DBC)
Fixation of heat sinks for transmissions, power supplies and transmission devices
LED lighting
Communication electronics

Available Packaging
Syringe: 50cc, 400cc, 600cc (A/B components packed separately)
Drum: 40kg (20kg Component A / 20kg Component B)

Storage Conditions
Store in a sealed container at temperature < 35℃ and relative humidity < 80%. Shelf life is 6 months from the date of manufacture.