LED Packaging Plasma Cleaner-Suzhou Aptel Electronics Technology

LED Packaging Plasma Cleaner

The plasma cleaner for LED packaging is an indispensable key piece of equipment in modern LED manufacturing processes. By performing atomic-level cleaning and activation on the surfaces of brackets and chips, it resolves the packaging quality issues that cannot be overcome by traditional cleaning methods, enabling a qualitative leap in the brightness, reliability, and service life of LED products. Especially in high-end packaging fields such as Mini/Micro LED, plasma cleaning has become a necessary process to ensure product performance and yield rate.

Message

Plasma Cleaner

Low Pressure Plasma System Atmospheric Plasma System Microwave Plasma Cleaner LED Packaging Plasma Cleaner Plasma Stripper Plasma Etching System

Adhesive

Epoxy Silicone Series PU Acrylate Silanization

Thermal Interface Material

Thermal Pad Thermal Conductive Gel Thermal Grease Thermal Conductive Insulator Phase Change Material Thermal And Wave Absorption Material EMI Shielding Material Thermal Potting Adhesive

Lubricant

Lubricating Oil Lubricating Grease Dry Film Lubricant

Cleaning Agent

Water-Based Cleaning Agent Semi-Aqueous Cleaning Agent Oil-Based Cleaning Agent Solvent Cleaning Agent

Release Agent

Rubber Composite PU Internal Release Agent Metal Die Casting Emerging Industry

Nanocoating

Organic Protective Film Organic Hydrophobic Film Functional Inorganic Film Functional Olefinic Carbon Film

Dispensing Equipment

Single-Component Dispensing System Two-Component Metering and Mixing System

Product Details

Core Positioning

A dedicated surface treatment device designed specifically for LED packaging. It generates plasma by exciting gases via radio frequency/microwave in either a vacuum or atmospheric pressure environment, performing atomic-level cleaning and activation on LED brackets and chips.

Core Applications (Three Key Process Nodes)

Before Die Bonding: Removes oxide layers and organic substances to enhance the adhesive strength of die bonding glue.
Before Wire Bonding: Cleans bonding pads to improve bonding strength and reduce the risk of wire breakage.
Before Phosphor Coating: Improves hydrophilicity to ensure uniform coating and enhance light extraction efficiency.

Key Advantages

Cleaning precision reaches the nano-to-micron level, no secondary pollution, and broad material compatibility. It increases the packaging yield rate by over 15% and extends the service life to more than 100,000 hours.

Equipment Types

Vacuum Type: High precision and excellent uniformity, suitable for high-end packaging such as Mini/Micro LED.
Atmospheric Pressure Type: Continuous operation and high efficiency, suitable for mass production lines of general lighting LEDs.
Microwave Type: No electrode contamination and high energy density, suitable for precision packaging requirements.

Core Values

It resolves the defects of traditional cleaning methods, improves the luminous efficiency and reliability of LEDs, and serves as an indispensable key piece of equipment for high-end LED packaging.

Core Positioning

Core Applications (Three Key Process Nodes)

Key Advantages

Equipment Types

Core Values