Plasma Adhesive Remover-Suzhou Aptel Electronics Technology

Plasma Adhesive Remover

The Plasma Adhesive Remover is a dedicated device that generates plasma by exciting gases such as oxygen via radio frequency/microwave in a vacuum environment. Through the dual effects of physical bombardment and chemical ashing, it efficiently removes photoresist and organic residues. Featuring dry and environmentally friendly processing, nanoscale precision, and low-temperature non-destructive treatment, its processing efficiency is 5–8 times that of wet stripping methods. Widely used in fields such as semiconductors, PCBs, OLEDs, and medical devices, it is mainly classified into three types: radio frequency, microwave, and ICP, serving as a core photoresist stripping equipment in high-end manufacturing processes.

Message

Plasma Cleaner

Low Pressure Plasma System Atmospheric Plasma System Microwave Plasma Cleaner LED Packaging Plasma Cleaner Plasma Stripper Plasma Etching System

Adhesive

Epoxy Silicone Series PU Acrylate Silanization

Thermal Interface Material

Thermal Pad Thermal Conductive Gel Thermal Grease Thermal Conductive Insulator Phase Change Material Thermal And Wave Absorption Material EMI Shielding Material Thermal Potting Adhesive

Lubricant

Lubricating Oil Lubricating Grease Dry Film Lubricant

Cleaning Agent

Water-Based Cleaning Agent Semi-Aqueous Cleaning Agent Oil-Based Cleaning Agent Solvent Cleaning Agent

Release Agent

Rubber Composite PU Internal Release Agent Metal Die Casting Emerging Industry

Nanocoating

Organic Protective Film Organic Hydrophobic Film Functional Inorganic Film Functional Olefinic Carbon Film

Dispensing Equipment

Single-Component Dispensing System Two-Component Metering and Mixing System

Product Details

Core Positioning

A dedicated device for efficiently removing photoresist and organic residues by exciting gases such as oxygen to generate plasma via radio frequency (13.56 MHz)/microwave (2.45 GHz) in a vacuum environment (10⁻³–10¹ Pa). It is primarily designed for dry photoresist stripping in the fields of semiconductors and micro-nano processing.

Core Working Principle

Combining physical bombardment (high-energy ions break down the photoresist layer structure) and chemical ashing (oxygen free radicals react with organic substances to form volatile matter that is then exhausted), with a processing time of 3–10 minutes per batch.

Key Components

Vacuum System + Reaction Chamber + Radio Frequency/Microwave System + Gas Control System + Temperature Control System (< 45℃) + High-Precision Control System

Typical Applications

Photoresist stripping after semiconductor lithography/etching, glue residue removal after PCB laser drilling, OLED mask cleaning, polymer surface treatment of medical devices

Core Advantages

Dry and environmentally friendly processing (no chemical solvents), nanoscale precision, low-temperature non-destructive treatment, 5–8 times higher efficiency than wet stripping methods, and low operation and maintenance costs.

Equipment Types

RF Type: The mainstream model with moderate cost, suitable for regular photoresist stripping requirements.
Microwave Type: Generates high-density plasma with no electrode contamination, suitable for photosensitive devices.
ICP Type: Offers high uniformity, suitable for photoresist stripping in advanced packaging and 3D structures.

Core Differences (vs. Plasma Cleaners)

It focuses on the removal of photoresist/organic adhesive layers, uses oxygen as the primary process gas, features higher processing intensity, and its applications are concentrated on the core processes of semiconductor manufacturing.

Core Positioning

Core Working Principle

Key Components

Typical Applications

Core Advantages

Equipment Types

Core Differences (vs. Plasma Cleaners)