Thermal pads are flexible high thermal conductivity insulating composite materials. Their core function is to fill the gaps between "heat-generating components" and "heat dissipation structures" in electronic devices (replacing air, a poor thermal conductor), rapidly conduct heat, while integrating insulation, buffering, and sealing functions.
They contain high thermal conductivity fillers (such as alumina), are compressible to fit contact surfaces, and resistant to high and low temperatures. Widely used in heat dissipation and protection of new energy vehicles (batteries/electronic control systems) and electronic devices (chips/PCBs).
