Thermal Conductive Insulator-Suzhou Aptel Electronics Technology

Thermal Conductive Insulator

Thermal insulation sheets are sheet-like materials integrating high thermal conductivity (0.9~8 W/m·K) and strong insulation (breakdown voltage ≥5kV/mm). Their base material is silicone/glass fiber cloth or similar, containing ceramic thermal conductive fillers, and they feature flexibility, temperature resistance (-60℃~180℃), and flame retardancy.

Placed between heat sources and heat sinks, they fill gaps to conduct heat and isolate circuits. Core applications include power supplies, new energy electronic control systems, 5G/AI chips, and other electronic devices, serving as key thermal management components to ensure the safe and stable operation of devices.

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Adhesive

Epoxy Silicone Series PU Acrylate Silanization

Thermal Interface Material

Thermal Pad Thermal Conductive Gel Thermal Grease Thermal Conductive Insulator Phase Change Material Thermal And Wave Absorption Material EMI Shielding Material Thermal Potting Adhesive

Lubricant

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Cleaning Agent

Water-Based Cleaning Agent Semi-Aqueous Cleaning Agent Oil-Based Cleaning Agent Solvent Cleaning Agent

Release Agent

Rubber Composite PU Internal Release Agent Metal Die Casting Emerging Industry

Nanocoating

Organic Protective Film Organic Hydrophobic Film Functional Inorganic Film Functional Olefinic Carbon Film

Dispensing Equipment

Single-Component Dispensing System Two-Component Metering and Mixing System

Product Details

Core Features

Form: Sheet-like (thickness: 0.1-10mm), excellent elasticity, customizable in size/shape, some with adhesive backing;
Core Properties: Dual functions of thermal conductivity and insulation, excellent insulation performance (breakdown voltage ≥1kV/mm), thermal conductivity: 1-20 W/(m·K) (medium to high);
Advantages: Easy installation (peel-and-stick), wide temperature resistance range (-40~200℃), vibration absorption capability, fills irregular gaps.

Typical Applications

New Energy Vehicles: Insulation and heat dissipation between battery cells in battery packs, isolation between IGBT modules and heat sinks, insulation and thermal conductivity for on-board chargers (OBC);
3C Electronics: Power management integrated circuits (PMIC) in laptops, insulation and heat dissipation between mobile phone motherboards and middle frames, LED power driver boards;
Medical/Optoelectronics: Transducers of ultrasonic equipment, insulation and heat dissipation for laser generator housings, power modules of medical devices.

Suitable Scenarios:Bonding of components requiring electrical isolation and heat dissipation, such as insulation and thermal conductivity between high-voltage components and metal heat dissipation structures.

Core Features

Typical Applications

Suitable Scenarios:Bonding of components requiring electrical isolation and heat dissipation, such as insulation and thermal conductivity between high-voltage components and metal heat dissipation structures.