Thermal phase change materials are a category of temperature-triggered thermal conductive functional materials: they remain solid at room temperature (facilitating easy transportation and installation), and automatically transform into a paste/liquid state when the temperature reaches 45~60℃ (the phase change point). They tightly fit between heat sources and heat sinks, fill micro-gaps, reduce thermal resistance, and integrate the dual properties of high-efficiency heat conduction and adaptive fitting. They are mainly used for precision thermal management of electronic components to ensure the stable operation of equipment.
