• Core Positioning

  A composite adhesive integrating thermal conductivity, potting, sealing, and protection functions. Designed for heat dissipation and encapsulation of electronic components, realizing the integration of "heat dissipation + protection".

• Composition

  Base material (epoxy/silicone/polyurethane) + thermal conductive fillers (alumina/boron nitride/graphene) + curing agent + additives (flame-retardant/anti-aging)

• Key Parameters

  Thermal conductivity: 0.8~10 W/(m·K); Bonding strength: 1~5MPa; Temperature resistance: -60~200℃; Curing conditions (room temperature/heating/UV); Insulation resistance: ≥10¹²Ω
  

  
  

• Typical Applications:New energy battery packs, electronic modules (ECU/PCB), LED driver power supplies, industrial power supplies, automotive electronics, sensor encapsulation

1.New Energy Vehicle Field (Core Requirements: High Thermal Conductivity, Flame Retardancy, Vibration Resistance)

1. Battery packs: Polyurethane/epoxy thermal potting adhesive is used to encapsulate battery modules, conduct heat from battery cells to heat dissipation plates, while providing sealing and moisture resistance, buffering vibration, and avoiding thermal runaway.

2. Electronic control systems (IGBT/MCU): High thermal conductivity silicone/epoxy thermal potting adhesive with thermal conductivity ≥5 W/(m·K), which rapidly dissipates heat from high-power devices and ensures the stable operation of electronic control systems.

3. Automotive sensors: Room-temperature curing epoxy thermal potting adhesive, which provides sealing protection and heat dissipation simultaneously, adapting to the automotive operating conditions of -40~85℃.

2.Industrial Electronics Field (Core Requirements: Temperature Resistance, Insulation, Long-Term Stability)

1. Industrial power supplies (server/communication power supplies): Medium-to-high thermal conductivity epoxy thermal potting adhesive with thermal conductivity of 2~4 W/(m·K), which provides heat dissipation, insulation, and flame retardancy simultaneously, ensuring the continuous operation of power supplies.

2. Inverters/servo controllers: Silicone thermal potting adhesive with temperature resistance of -50~150℃, adapting to high-temperature industrial environments, with anti-aging and anti-electromagnetic interference properties.

3. PCB board potting: Low-viscosity epoxy thermal potting adhesive, which fills gaps between components, provides sealing, moisture resistance, and dustproofing, and improves the reliability of circuit boards (such as outdoor instruments and electronic devices for chemical equipment).

3.Consumer Electronics and LED Field (Core Requirements: Rapid Curing, Lightweight, Environmental Protection)

1. LED driver power supplies: Silicone/epoxy thermal potting adhesive with thermal conductivity of 1~3 W/(m·K), which provides heat dissipation and waterproofing simultaneously, extending the service life of LEDs (such as outdoor lighting and display screens).
2. 3C electronics (mobile phone/computer power adapters): UV-curable thermal potting adhesive, which cures within a few seconds, adapts to automated production lines, and features a lightweight design that does not increase product weight.

3. Smart wearable devices: Low-viscosity, flexible thermal potting adhesive, adapting to precision components, providing heat dissipation and buffering collisions simultaneously (such as smart watches and earphone charging cases).

4.Special Fields (Core Requirements: Adaptation to Extreme Environments)

1. Aerospace electronics: Ultra-high thermal conductivity boron nitride-based potting adhesive with thermal conductivity ≥8 W/(m·K), temperature resistance of -60~200℃, radiation resistance, and vibration resistance.

2. Medical equipment (such as ultrasonic probes and monitors): Medical-grade epoxy/silicone potting adhesive, biocompatible with no leaching, providing heat dissipation and sealed antibacterial protection simultaneously.

3. Underwater equipment (such as sensors and detectors): Polyurethane thermal potting adhesive with excellent waterproof performance (water pressure resistance ≥1MPa), conducting heat and isolating seawater corrosion simultaneously.
   

• Core Value:The "Heat Dissipation and Protection Shield" for Electronic Devices
  

• Efficient heat dissipation and extended service life: Rapidly dissipates heat from components, reduces operating temperature (10~30℃), reduces high-temperature aging, and extends equipment service life by 30%~50%.
  

• Multiple protections and improved reliability: Integratively realizes sealing, moisture resistance, dustproofing, vibration resistance, insulation, and flame retardancy, avoiding faults caused by the external environment (such as short circuits and corrosion), and increasing product qualification rate from 95% to over 99%.

• Simplified design and reduced cost: Replaces the combined solution of "heat sink + seal + fixing part", reduces the number of components, simplifies the production process, and reduces comprehensive costs by 20%~30%.

• Adaptation to complex scenarios: Resistant to high and low temperatures, corrosion, and vibration, covering the full range of needs from industrial workshops to outdoor environments, and from automobiles to aerospace.
  

• Environmental compliance: Solvent-free, low VOC, flame-retardant formula, complying with global environmental policies (such as EU REACH and China GB standards), ensuring production and use safety.
  

• Core Value：Efficiently dissipates heat from components, isolates water vapor/dust/vibration, protects precision electronic parts, extends service life, and ensures stable operation of equipment.