Internal Release Agent-Suzhou Aptel Electronics Technology

Plasma Cleaner

Low Pressure Plasma System Atmospheric Plasma System Microwave Plasma Cleaner LED Packaging Plasma Cleaner Plasma Stripper Plasma Etching System

Adhesive

Epoxy Silicone Series PU Acrylate Silanization

Thermal Interface Material

Thermal Pad Thermal Conductive Gel Thermal Grease Thermal Conductive Insulator Phase Change Material Thermal And Wave Absorption Material EMI Shielding Material Thermal Potting Adhesive

Lubricant

Lubricating Oil Lubricating Grease Dry Film Lubricant

Cleaning Agent

Water-Based Cleaning Agent Semi-Aqueous Cleaning Agent Oil-Based Cleaning Agent Solvent Cleaning Agent

Release Agent

Rubber Composite PU Internal Release Agent Metal Die Casting Emerging Industry

Nanocoating

Organic Protective Film Organic Hydrophobic Film Functional Inorganic Film Functional Olefinic Carbon Film

Dispensing Equipment

Single-Component Dispensing System Two-Component Metering and Mixing System

Product Details

Core Positioning：An internal-added functional molding auxiliary chemical incorporated into plastics, rubber, composite materials and other substrates. It eliminates the need for additional mold coating; instead, it migrates to the material surface during processing to form an isolation layer, enabling smooth demolding.
Components：
- Mainstream Types：Silicone-based (excellent migration performance and strong demolding effect, compatible with most substrates); Fatty acid salt-based (zinc stearate/calcium stearate, low cost, suitable for plastics/rubber); Wax-based (microcrystalline wax/polyethylene wax, good dispersibility); Polyether-based (low residue, suitable for subsequent bonding/coating processes)
- Auxiliary Components：Dispersants (ensure uniform dispersion in substrates); Stabilizers (prevent interference with substrate curing/vulcanization)
Core Principles：Added to substrates (resins, rubber, composite matrices, etc.), it migrates to the material-mold interface through molecular migration during heating and pressurization processing, automatically forming a low-surface-energy (≤28 mN/m) isolation film. This reduces the adhesion between the substrate and the mold, eliminating the need for additional mold coating and achieving high-efficiency demolding.
Typical Applications：Molding processes that do not require additional mold coating, including plastic injection molding (PP, ABS, PVC products), rubber vulcanization (O-rings, seals), composite compression molding (carbon fiber products), polyurethane foaming (sponges, elastomers), and resin casting (crafts, building materials).
Advantages：Easy to use (eliminates mold coating steps and improves production efficiency); Uniform demolding (comprehensive migration coverage, suitable for complex cavity/thin-walled products); Mold contamination-free (reduces mold cleaning frequency); Compatibility with substrate systems (no impact on product mechanical properties/appearance); Suitability for continuous production (lowers labor costs).
Key Parameters：Addition level (0.1%–5%, adjusted according to substrate type); Migration rate (matched to processing cycle); Applicable substrates (plastics/rubber/composites/polyurethane, etc.); Temperature resistance range (80–300℃, adapted to processing temperatures); Residue content (≤0.1%, no impact on subsequent bonding/coating).