Epoxy-Suzhou Aptel Electronics Technology

Plasma Cleaner

Low Pressure Plasma System Atmospheric Plasma System Microwave Plasma Cleaner LED Packaging Plasma Cleaner Plasma Stripper Plasma Etching System

Adhesive

Epoxy Silicone Series PU Acrylate Silanization

Thermal Pad Thermal Conductive Gel Thermal Grease Thermal Conductive Insulator Phase Change Material Thermal And Wave Absorption Material EMI Shielding Material Thermal Potting Adhesive

Lubricant

Lubricating Oil Lubricating Grease Dry Film Lubricant

Cleaning Agent

Water-Based Cleaning Agent Semi-Aqueous Cleaning Agent Oil-Based Cleaning Agent Solvent Cleaning Agent

Release Agent

Rubber Composite PU Internal Release Agent Metal Die Casting Emerging Industry

Nanocoating

Organic Protective Film Organic Hydrophobic Film Functional Inorganic Film Functional Olefinic Carbon Film

Single-Component Dispensing System Two-Component Metering and Mixing System

Product Details

Definition
Epoxy resin is an extremely important polymer material. Thanks to its unique properties, it has wide applications in many fields. Simply put, it is a type of "adhesive" or "plastic" that requires mixing with a curing agent to cure. Epoxy resin adhesives are usually two-component: Component A (epoxy resin) and Component B (curing agent) undergo an addition polymerization reaction after mixing, forming a three-dimensional crosslinked network structure.
Characteristics

Super Strong Adhesion: It can firmly bond various materials such as metals, plastics, ceramics, and glass, and even achieve excellent results on some hard-to-bond materials.
High Mechanical Strength: The three-dimensional crosslinked network structure formed after curing endows it with high mechanical strength and hardness, enabling it to withstand large pressure and impact.
Low Shrinkage Rate: The volume shrinkage during curing is very small (usually 1%-3%), which can effectively reduce internal stress, avoid cracks or deformation at the bonded parts, and ensure bonding stability.
Corrosion Resistance and Insulation: It has good resistance to chemicals such as acids, alkalis, and solvents, and also possesses excellent electrical insulation properties, making it widely used in the packaging and protection of electronic components.
Strong Environmental Adaptability: It can withstand extreme temperature changes from -40°C to 150°C, suitable for bonding needs in outdoor and harsh environments.

Structural bonding of electronic components (PCB boards, semiconductor packaging);
High-strength bonding of industrial equipment (mechanical parts, pipelines);
Molding and bonding of composite materials (carbon fiber/glass fiber).