CollTech EW 6710 is a one-component, solvent-free, heat-curable epoxy underfill adhesive designed for chip protection. It features low viscosity, high fluidity, impact and vibration resistance as well as reworkability. It cures completely within 10 minutes at 150℃. After curing, it achieves a Shore D hardness of 86 and a bonding strength of 18 MPa on FR4 substrates, with excellent electrical properties. Supplied in 30ml syringe packaging, it requires storage at a temperature of -20~5℃, with a shelf life of 6 months.