EW 6684-3-Suzhou Aptel Electronics Technology

EW 6684-3

CollTech EW 6684-3 A/B is a two-component, solvent-free epoxy adhesive. Mixed at a ratio of 2:1, it features a pot life of 30 minutes and an initial curing time of 8 hours at 25℃. It exhibits excellent adhesion to substrates such as aluminum and PCBs. After curing, it achieves a hardness of Shore D80 and an aluminum-to-aluminum lap shear strength of 34 MPa. Suitable for bonding electronic components, it is supplied in 50ml cartridges.

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Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

Favored

Product Details

Product Description
EW 6684-3 A/B is a two-component, solvent-free adhesive formulated on an epoxy system, suitable for bonding or reinforcing operations of electronic components.

Product Features

Excellent adhesion to various substrates including aluminum, PCBs and glass
Halogen-free
Outstanding reliability under temperature and humidity cycling conditions
Convenient application via multiple processes such as automatic and manual dispensing

Storage Conditions

The product achieves the maximum shelf life when stored in a cool and dry place (temperature range: 10-25℃);
Under such conditions, the shelf life is 6 months.