HiPad10K（HF）-Suzhou Aptel Electronics Technology

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Plasma Cleaner Adhesive Thermal Interface Material Lubricant Cleaning Agent Release Agent Nanocoating Dispensing Equipment

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Adhesive Thermal Interface Material Cleaning Agent Release Agent Nanocoating

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HiPad10K（HF）

HiPad10K(HF) is a high-thermal-conductivity, low-volatility, low-oil-seepage gap pad material with a thermal conductivity of 10.3 W/m·K. The recommended compression ratio of the product ranges from 15% to 70%, with the recommended design target compression ratio of 35%. The standard thickness step is 0.25mm. It is recommended to select an appropriate thickness to control the compressive stress in applications.

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Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

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Product Details

Product Parameters

Product Features

Thermal conductivity: 10.3 W/m·K
Low volatility and low oil seepage
Single-sided/double-sided adhesiveness optional
Good surface wettability
Compliance with RoHS/REACH environmental standards

Typical Applications

Communication base stations
Servers
Storage devices
Circuit boards
Routers

Available Packaging

Standard size: 450mm×450mm; custom die-cutting available according to customer's application dimensions

Storage Conditions
Shelf life: 12 months at room temperature from the date of manufacture