HiPad3000-Suzhou Aptel Electronics Technology

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Plasma Cleaner Adhesive Thermal Interface Material Lubricant Cleaning Agent Release Agent Nanocoating Dispensing Equipment

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Adhesive Thermal Interface Material Cleaning Agent Release Agent Nanocoating

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HiPad3000

HiPad3000 is a medium-hardness, high-thermal-conductivity gap pad material with a thermal conductivity of 3.0 W/m·K. The recommended compression ratio of the product ranges from 15% to 70%, with the recommended design target compression ratio of 40%. The typical thickness range of the product is 0.5mm to 9.0mm, and the standard thickness step is 0.25mm. It is recommended to select an appropriate thickness to control the compressive stress in applications.

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Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

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Product Details

Product Parameters

Product Features

Thermal conductivity: 3.0 W/m·K
Medium-hardness (Shore 00 50)
Low compressive stress and residual stress
Good surface wettability
Compliance with RoHS/REACH environmental standards

Typical Applications

New energy vehicles (NEVs)
Network communication equipment
Storage devices
Communication base stations
PCs (Personal Computers)

Available Packaging

Standard size: 450mm×450mm; custom die-cutting available according to customer's application dimensions

Storage Conditions
Shelf life: 24 months at room temperature from the date of manufacture