LOCTITE ABLESTIK 84-1LMISR4-Suzhou Aptel Electronics Technology

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Plasma Cleaner Adhesive Thermal Interface Material Lubricant Cleaning Agent Release Agent Nanocoating Dispensing Equipment

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Adhesive Thermal Interface Material Cleaning Agent Release Agent Nanocoating

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LOCTITE ABLESTIK 84-1LMISR4

LOCTITE ABLESTIK 84-1LMISR4 is a conductive die attach adhesive, specifically engineered for high-throughput, automated die attach equipment. Its optimized rheological properties enable minimal adhesive dispense volume and reduced die placement dwell time, while eliminating stringing or tailing issues. This unique combination of performance features makes it one of the most widely used die attach materials in the semiconductor industry.

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Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

Favored

Product Details

Product Description

Technology Type:Epoxy Resin
Uncured Appearance:Silver
Curing Method:Thermal Curing
pH Value:6.0
Product Advantages:Electrically conductive; Oven-curable; Excellent dispensing performance; Minimal stringing and tailing
Application Scenario:Die Attach for Plastic Ball Grid Array (PBGA), Flexible Ball Grid Array (FlexBGA), Stacking Ball Grid Array

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