LOCTITE ABLESTIK 2025D-Suzhou Aptel Electronics Technology

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Plasma Cleaner Adhesive Thermal Interface Material Lubricant Cleaning Agent Release Agent Nanocoating Dispensing Equipment

Brand

Adhesive Thermal Interface Material Cleaning Agent Release Agent Nanocoating

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LOCTITE ABLESTIK 2025D

LOCTITE ABLESTIK 2025D is a red thermal-curing die attach adhesive formulated with a proprietary hybrid chemical system. It features low bleed, excellent adhesion to multiple substrates and high humidity-resistant shear strength. Specifically designed for array packages such as PBGA and FlexBGA, this product has a shelf life of up to 365 days at -40°C and is compatible with industrial dispensing and curing processes.

Message

Adhesive

Henkel CollTech

Thermal Interface Material

Bergquist RhytonTech CollTech

Cleaning Agent

iboychem

Release Agent

Lorechem

Nanocoating

Favored

Product Details

Product Description

Technology Type:Proprietary Hybrid Chemical System
Curing Method:Thermal Curing
Product Advantages:Extremely low bleed; Excellent adhesion to multiple substrates; High humidity-resistant die shear strength
Application Scenario:Die Attach
Filler Type:Silica
Typical Packaging Applications:Plastic Ball Grid Array (PBGA), Flexible Ball Grid Array (FlexBGA), Stacking Ball Grid Array