Product Description

• Technology Type:Epoxy Film Adhesive
  

• Uncured Appearance:Grayish Tan
  

• Curing Method:Thermal Curing
  

• Product Advantages:Clean and easy to dispense; No waste; Uniform heat dissipation; Excellent electrical continuity; Ultra-low thermal resistance with heat sinks; Compliant with NASA outgassing standards
  

• Application Scenario:Assembly (Electrical, Thermal and Mechanical Assembly)
  

• Filler Type:Silver
  

• Operating Temperature Range:-40°C to 160°C
  

• Film Thickness:2 or 4 mils (±0.5 mils)
  

• Carrier Type:Polyester
  

• Typical Assembly Applications:Circuits, Metal Substrate Materials, Backplanes and Heat Sinks
  

• Compatible Substrates:Fluoropolymer Circuits, Ceramic Circuits, Copper, Brass, Kovar and Aluminum
  

• pH Value:6.0
  

Instructions for Use

1. While substrate cleaning is not mandatory, it is recommended to wipe the surfaces with an organic solvent (e.g., isopropyl alcohol) to remove oil stains that may affect the bonding process.
2. Pressure must be applied during curing to promote full wetting of the substrate surfaces.
3. Common industrial pressure application methods include spring clamps, laminators, weights, and vacuum bagging.
4. The pressure application technique can be adjusted based on the application scenario and customer preferences.
5. For large-area applications, it is recommended to place a load-spreading material between a pressure plate and the bonded components to ensure uniform pressure across the entire area.
6. After securing the components, cure them at an elevated temperature.
7. The specified temperature and time refer to the adhesive layer temperature. Note that large-mass assemblies require more time to reach the set adhesive layer temperature.
8. LOCTITE ABLESTIK CF 3350 will become brittle when stored at temperatures below -5°C. If the material is exposed to such temperatures, handle it with care. Before opening the container, allow the entire package to warm up to room temperature to minimize the risk of breakage in the brittle state or moisture condensation on the product surface.
9. Storing uncured film at temperatures above 5°C may shorten the shelf life.
10. Storing uncured film at temperatures below -5°C will cause brittleness, and there is a risk of cracking during handling at low temperatures.

Storage Conditions

• Optimal Storage Temperature: 5°C