Product Description

• Technology Type:Acrylate
  

• Appearance:Blue Liquid
  

• Product Advantages:One-component; Non-conductive; Halogen-free; Fluorescent; Fast curing; Thixotropic
  

• Curing Method:Thermal Curing
  

• Application Scenario:Electronic Potting of Printed Circuit Boards (PCBs)
  

• Typical Packaging Applications:BGA (Ball Grid Array), CSP (Chip Scale Package)
  

Instructions for Use

1. Thawed material should be immediately loaded into dispensing equipment for use.

2. If transferring the adhesive to the final dispensing reservoir, care must be taken to avoid contamination and/or air entrapment in the adhesive.

3. The adhesive must be completely used up within the product’s recommended working life.

4. Dispensing volume can be adjusted according to application requirements.

5. Star or cross dispensing patterns can reduce adhesive layer voids compared to matrix dispensing patterns.

Storage Conditions

• Optimal Storage Temperature: -20°C. Temperatures below -25°C or above -15°C may adversely affect product performance.