Product Description

• Technology Type:Epoxy Resin
  

• Appearance:Black Liquid
  

• Product Advantages:One-component;Medium-temperature rapid curing; High glass transition temperature (Tg); Halogen-free; Compatible with most lead-free solders; Stable performance under humid and hot conditions; Stable electrical performance; Reworkable; Room-temperature flowability
  

• Typical Applications:Underfill
  

• Typical Packaging Applications:Chip Scale Package (CSP), Ball Grid Array (BGA)
  

Thawing Procedures

1. A 30cc syringe must be thawed to room temperature for at least 1 hour.

2. Allow the container to return to room temperature before use.

3. After removing from the freezer, place the syringe vertically during the thawing process.

4. Do not open the container until the contents reach 25°C. Remove any condensation on the container surface after thawing before opening.

5. Once thawed to 25°C, the adhesive must not be refrozen.

Instructions for Use

1. The thawed material should be loaded into the dispensing equipment and used immediately.

2. If the adhesive needs to be transferred to a final dispensing reservoir, take precautions to avoid contaminants and/or air entrapment in the adhesive.

3. The adhesive must be completely used up within the recommended working life of the product.

Storage Conditions

• Optimal Storage Temperature: -25°C to -15°C. Temperatures above -15°C may adversely affect product performance.

• Material removed from the container may be contaminated. Do not pour it back into the original container.