Product Description

• Technology Type:Acrylate
  

• Uncured Appearance:Colorless to Off-White Translucent Paste
  

• Product Advantages:One-component (no mixing required); Fast UV/visible light curing; Flexible; Low viscosity
  

• Curing Method:UV/Visible Light Curing
  

• Application Scenarios:Edge Bonding
  

• Typical Packaging Application:BGA (Ball Grid Array)
  

• Key Substrates:Various substrates, glass, most plastics and metals
  

Instructions for Use

1. This product is light-sensitive. Minimize exposure to sunlight, ultraviolet (UV) light and artificial light during storage and operation.

2. Apply the product using a black feed tube.

3. To ensure optimal performance, bonding surfaces must be clean and free of contaminants.

4. Apply the adhesive to only one of the two bonding surfaces before assembling the components.

5. Curing time depends on lamp intensity, distance from the light source, light source type, required curing depth, bonding gap and light transmittance of the substrate that the light needs to penetrate.

6. Provide cooling measures for temperature-sensitive substrates.

7. Pay attention to the risk of stress cracking when crystalline and semi-crystalline thermoplastic materials come into contact with the liquid adhesive.

8. Excess uncured adhesive can be wiped off with organic solvents such as acetone.

9. Allow the assembled components to cool down completely before subjecting them to operational loads.

Storage Conditions

• Optimal storage temperature: 8–28℃. Temperatures below 8℃ or above 28℃ may adversely affect product performance.

• Material removed from the container may be contaminated. Do not pour it back into the original container.