Product Description

• Technology Type:Epoxy Resin
  

• Uncured Appearance (Resin):Black
  

• Product Advantages:Thermally conductive; Electrical insulation; Low coefficient of thermal expansion (CTE); Thermal shock resistance; Compatible with multiple catalysts
  

• Application Type:Thermally Conductive Epoxy Potting Compound
  

• Typical Assembly Application:Potting of heat-resistant and thermal shock-resistant components
  
  

Instructions for Use

1. Some resins and curing agents are prone to crystallization. If crystallization occurs, heat the packaged container to 50–60℃ until the crystals are completely dissolved, then loosen the container cap to release pressure.
2. Wait for the contents to cool down to room temperature before proceeding with subsequent operations.
3. Substrates must be thoroughly cleaned to remove oxides, dust, moisture, oil stains and other contaminants, so as to avoid affecting adhesion or causing corrosion.
4. Component separation may occur during transportation and storage. It is recommended to fully mix the materials in the package before use.
5. Intensive mixing is recommended to ensure product uniformity.
6. Weigh the resin and curing agent into a clean container in the recommended ratio, and the weighing accuracy shall match the material dosage.
7. For manual mixing, adopt a kneading motion to scrape materials from the bottom and sides of the container, and mix for 2–3 minutes until uniform.
8. Avoid high-speed mixing (which will entrain excessive air). Additional mixing for 2–3 minutes can be performed if needed. High-speed mixing may cause material overheating and shorten the pot life.
9. To achieve void-free potting, entrapped air must be removed: perform degassing before potting or vacuumize after potting.
10. After mixing, vacuumize to 1–5 mmHg. Foam will rise; continue degassing until bubbles basically disappear (usually takes 10–30 minutes).
11. For materials that are difficult to degas, add 1–3 drops of defoamer (e.g., ANTIFOAM 88) to 100 grams of the material.
12. Heating will reduce viscosity but shorten the pot life.
13. Pour the mixed material into the mold or assembly. Heating the potting cavity can reduce viscosity, facilitating the potting of complex-shaped or compact components.
14. Critical applications may require further degassing in the mold.

Storage Conditions

• Optimal Storage Temperature: 18–25℃
• Material removed from the container may be contaminated. Do not pour it back into the original container.